TI unveils multiple radio solution

Texas Instruments (TI) has introduced 'WiLink 8.0,' a collection of 45-nanometer single-chip solutions integrating up to five different radios, for next-generation mobile Wi-Fi, GNSS, NFC, Bluetooth and FM transmit/receive applications.

The WiLink 8.0 solution supports various combinations of these technologies, allowing for customized solutions to address the unique needs and price points of all mobile markets. Each chip variant comes in a compact WSP package that can be mounted directly on a PCB, and includes all required RF front ends, a complete power management system, and comprehensive coexistence mechanisms.

At the system level, it offers a 60 percent cost reduction, 45 percent decrease in size and 30 percent lower power consumption compared to traditional multi-chip offerings.

''Bringing a highly integrated, five-in-one radio chip like WiLink 8.0 to market requires the careful development of complex wireless technologies with co-existence and low-power mechanisms, among other things. Our innovation leadership is reflected in the comprehensive WiLink 8.0 family, which will forge the path to next-generation connected experiences across all mobile devices,'' said Haviv Ilan, VP and GM wireless connectivity solutions, TI.