ST Microelectronics manufactures MEMS (Micro-Electro-Mechanical Systems) for consumer and portable applications in plastic packages. The patented technology is said to save space and increases durability in consumer and professional voice-input applications, from mobile phones and tablets to noise-level meters and noise-cancelling headphones.
ST's novel microphone-assembly process ensures superior electrical and acoustic performance, unbeatable mechanical robustness, and slimmer form factors, while simultaneously advancing the microphone chip size reduction to 2x2 mm in devices that will soon arrive in the market. This technology development paves the way to introducing microphones embedded in silicon cavities as the ultimate step in device miniaturization, claimed a press release.
ST's plastic-package microphones integrate an internal shielding cage for uncompromised electromagnetic immunity and are compatible with standard surface-mount assembly machinery and conventional pick-and-place equipment.
ST's MEMS microphones will suit audio applications across existing and emerging market segments, including mobile phones, laptops and tablets, portable media players, gaming equipment and cameras, as well as noise-cancelling headphones and potentially even hearing aids.