Qualcomm launches 3 new mid-range Snapdragon processors

NEW DELHI: Qualcomm Technologies has introduced three new Qualcomm Snapdragon processors in its Snapdragon 600 and 400 tiers: the 653, 626, and 427.

The new Snapdragon processors are designed to deliver higher levels of processing performance than their predecessors for high performance and high volume mobile devices. Qualcomm said that around 400 OEM designs have been made based on Snapdragon 600-tier chipsets over the past 12 months, including more than 300 devices launched and more than 100 device designs currently in the pipeline.

The Snapdragon 653 processor not only features an increase in CPU and GPU performance over the Snapdragon 652, but also doubles the addressable memory (RAM) from 4GB to 8GB supporting greatly enhanced user experiences.

The Snapdragon 626 features a CPU performance increase over the Snapdragon 625. It also features Qualcomm TruSignal antenna boost, designed to improve signal reception in congested areas.

The Snapdragon 427 delivers a CPU and GPU performance increase over the Snapdragon 425. It is the first chipset to bring TruSignal to the Snapdragon 400 tier of processors, designed to deliver unprecedented powerful antenna tuning to this high volume line of processor solutions.

All three new processors are designed to support Qualcomm Quick Charge 3.0 technology, designed to deliver power up to 4X faster compared to traditional charging methods.

In addition, support for dual camera has been extended from the Snapdragon 800 tier to the Snapdragon 600 and 400 tiers, for clear imaging and photos across a wider variety of photo capture scenarios, to further enhance consumer experiences.

The advanced modem capabilities can increase network capacity and improve throughputs for all users in the network. Each chipset supports the following modem features:

X9 LTE, with Cat 7 downlink speeds up to 300Mbps, and Cat 13 uplink speeds up to 150Mbps, designed to provide users with a 50 percent increase in maximum uplink speeds over the X8 LTE modem.
LTE Advanced Carrier Aggregation with up to 2×20 MHz in the downlink and uplink
Support for 64-QAM in the uplink
Superior call clarity and higher call reliability with the Enhanced Voice Services (EVS) codec on VoLTE calls.

The Snapdragon 653 and 626 chipsets are expected to be commercially available by the end of 2016. The Snapdragon 427 chipset is expected to be in commercial devices in early 2017.