Open OS 3G handsets from Ericsson and TI by 2008

Bangalore

July 24, 2007

Ericsson the world's leading telecom supplier, and Texas Instruments
Incorporated (TI), the global leader in silicon solutions for wireless
communications, today announced that the companies will form a strategic
technology engagement to develop custom solutions for new Open OS enabled 3G
devices.

Solutions from the technology created by the two companies will combine small
and power efficient 3G modems from Ericsson Mobile Platforms with
high-performance OMAPâ„¢ applications processors from TI. Solutions from the
joint engagement will include OMAP, custom basebands and connectivity
technologies and will be capable of supporting the major Open OS, which offer
easy access to a rich array of applications and services. The result of this
joint effort will enable all device manufacturers to offer advanced Open OS
handsets for both the high-end and the rapidly growing mid-range market.

The collaboration between Ericsson and TI will enable handset manufacturers
to deliver the exciting mobile entertainment and multimedia experiences that
consumers around the world are increasingly demanding. Ericsson's access
technology leadership, current HSPA-enabled platforms, and future HSPA evolution
and LTE technologies, combined with the cutting-edge multimedia performance
enabled by TI's OMAP 2, OMAP 3 and future generations of OMAP processors, will
continue to push the performance boundaries of mobile devices and mobile
entertainment features.

By leveraging TI's OMAP platform with Open OS support for Windows Mobile,
Symbian S60, Symbian UIQ and Linux, these solutions will provide OEMs and
operators with a robust and flexible architecture for applications and services
deployment, enabling easier delivery and management of services and content.
This enables handset manufacturers and mobile operators to differentiate their
products through rich, easy-to-use and customizable user interfaces, and through
a robust and flexible application architecture.

Greg Delagi, senior vice president of TI's Wireless Terminals Business Unit,
says: "It's a tribute to the long-standing collaborative relationship
between EMP and TI that we can tap into and combine each company's unique
wireless expertise in order to deliver the most timely, targeted solutions to
the market."

The solutions, which seamlessly integrate the modem and applications
processor, will be presented in one pre-verified and tested platform reference
design. This approach will drastically reduce development and verification
efforts previously undertaken by device manufacturers, enabling customers to
rapidly bring highly advanced yet competitively priced products to market.

The joint solutions will also benefit from the Ericsson Mobile Platforms IOT
program, one of the industry's most extensive interoperability testing
processes, guaranteeing full compliance with operator requirements, speeding up
time to market and securing an easy roll-out of products.

Robert Puskaric, head of Ericsson's mobile platforms' unit, says: "We
are pleased to work closely with TI to combine the finest of each company's core
wireless know-how - EMP's access technology and platform size leadership with
TI's innovative OMAP application processors in order to provide the most capable
Open OS platforms on the market today."

Handsets based on these solutions are expected to be available on the market
in the second half of 2008.