Huawei and Qualcomm Drive Commercial HSPA+ technology

Huawei has announced, along with partner Qualcomm, the completion of the interoperability tests on dual carrier HSPA+ (High Speed Packet Access Plus) technology. The test, which reached a peak downlink data rate of 42Mb/s, the fastest downlink rate experienced by 3G end-users, demonstrates that dual-carrier HSPA+ technology is ready for commercial deployment. Huawei's latest HSPA+ solution and Qualcomm's Mobile Data Modem (MDM) MDM8220 chipsets were used in this interoperability test. Implemented with dual cell technology, Huawei's HSPA+ solution can transmit data via two or more carriers, resulting in the downlink data rate of 42Mb/s, which improves an operator's spectrum resources, enhances spectral efficiency and provides capacity gains of up to 20%. Alex Katouzian, vice president of product management, Qualcomm CDMA Technologies, said, “Qualcomm is pleased to be working with Huawei to bring dual-carrier HSPA+ technologies to market. We remain committed to WCDMA modem leadership and the seamless and cost-effective commercialization of next-generation technologies around the world.”