Broadcom introduces NFC Chips in 40 NM

Broadcom has unveiled a new family of NFC chips to drive the mass deployment of NFC in consumer electronics devices at P&T Expo Comm held in China. The chipset, Broadcom BCM2079x is manufactured in 40 nm CMOS technology, it slashes power consumption by more than 90 per cent, uses 40 per cent fewer components and has a 40 per cent smaller board area, making it the smallest and most power efficient NFC solution on the market, claimed a release.

USP of BCM2079x

* Reduces polling power consumption by more than 90 percent for longer battery life

* Support for field power harvesting allows the chip to draw energy from the environment so it can support transactions even if the phone battery has expired

* It integrates more external components, reducing total solution BOM (bill of materials) costs

* Complete Broadcom software stack including Maestroâ„¢ middleware rounds out end-to-end solution for reduced design complexity, creative connectivity options and faster time to market

* Multiple SWP (single wire protocol) interfaces allow for standards-based SIM and embedded secure element integration