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NEW DELHI: Samsung Electronics said that it has showcased its advanced component technologies in its second Samsung Mobile Solutions Forum 2017 held in New Delhi, India.
Under the slogan, “Leading the way, shaping the future,” Samsung offered insight on the latest global trends within the industry as well as the company’s vision and strategy for India’s dynamic mobile landscape.
The mobile ecosystem in India has been experiencing unprecedented development within the past few years and market demand for value-added products has increased sharply. Through its second SMSF India event, Samsung continues to recognize the opportunities that India brings and the potential the market holds.
“India is witnessing an extraordinary digital communication revolution with growth prospects never seen before, and Samsung is thrilled to catalyze this change by providing total technology solutions to our customers,” said Haejin Park, Vice President and Head of Device Solutions in Southeast Asia, Samsung Electronics.
Samsung’s branded image sensor ISOCELL was highlighted at the event with demos for its technological sub-brands—Bright, Fast, Slim and Dual—that meet diverse needs of cameras for today’s mobile applications. The brand is named after the company’s own image sensor technology that allows high color fidelity and excellent image quality even with smaller pixels. Samsung’s advanced semiconductor solutions also on display included near field communication (NFC) mobile payment solution, touch controller supporting force home key feature, LPDDR4-based mobile DRAM, and T5 portable solid state drive (SSD).
Following its first components forum in India, the Samsung Image Sensor Forum (2015), Samsung reinforced its presence the next year through the Samsung Mobile Solutions Forum India, presenting a comprehensive lineup of its leading mobile component solutions.
More than 200 industry professionals ranging from mobile manufacturers and OEM (original equipment manufacturer) companies, to design engineers and researchers for mobile devices and technologies attended the forum.